Apple revolutionizes the Mac Pro chassis with cylindrical with deep chassis redesign of internal structure. Xeon processors and AMD FirePro GPU E5, becomes available in the coming months.
Among the novelties presented at the inaugural conference of the Worldwide Developers Conference Apple 2013 stands out in particular the new Mac Pro system, the subject of a thorough review of design that has allowed Apple to create a compact system and unusual cylindrical appearance. Phil Schiller, the new Mac Pro began saying "can't innovate anymore, my ass", whose meaning is easily understood.
The new aluminium chassis, Mac Pro has dimensions of 25 cms tall and 16 cms in diameter, for a volumetric dimensions equal to 1/8 compared to current generation Mac Pro systems
Also news regarding the GPU, with the presence of two AMD FirePro cards with 6GB of memory dedicated VRAM, capable of expressing a computational power up to 7 Teraflops. Mac Pro has a chance, in this way, also support 4 k-type display.
Among the novelties presented at the inaugural conference of the Worldwide Developers Conference Apple 2013 stands out in particular the new Mac Pro system, the subject of a thorough review of design that has allowed Apple to create a compact system and unusual cylindrical appearance. Phil Schiller, the new Mac Pro began saying "can't innovate anymore, my ass", whose meaning is easily understood.
The new aluminium chassis, Mac Pro has dimensions of 25 cms tall and 16 cms in diameter, for a volumetric dimensions equal to 1/8 compared to current generation Mac Pro systems
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A cylindrical case imposes a complete reorganization of internal components: here is that the main Mac Pro Logic boards are fastened to a Prism-shaped sink, which Apple calls "unified thermal core". This allows you to use a single cooling fan, which is located on the top of the unit that creates a flow of air from the bottom upwards, thus leaving out the hot air from the top of the cylinder.
On the hardware front were not released specific details, with final configurations that will be announced at the actual market release. The new Mac Pro will use Intel Xeon processor E5 allowing to get to "combat" configurations up to 12 cores. The new Mac Pro PCI Express technology of the third generation leading up to 40 GBps bandwidth, with read and write speeds up to 1.25 GBps, and 1.0gbps.
The memory subsystem is DDR3 ECC modules of type four-channel, operating at a frequency of 1866 MHz and allow you to get a 60 GB/s bandwidth.
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With regard to the storage compartment Apple chooses to rely exclusively on PCIe flash solutions to 1250 MB/s, sending retired definitively the internal hard disk magnetic/mechanical type. For mass storage users will have to rely on external drives, which can be connected to the system using the new Thunderbolt 2 interface technology, recently announced by Intel.
Expand considerably the possibilities for connection to external devices, with the presence of six Thunderbolt 2 ports, four SuperSpeed USB, two Gigabit Ethernet connectors, HDMI 1.4 and audio in/out connectors. The new Thunderbolt 2 interface, we recall, has the ability to support 20 GBps throughput and up to six devices daisy-chained on each port.
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The new Mac Pro, at least according to currently available information, it appears to be devoid of any optical drive: also in this case, users must rely on external solutions.
The availability is expected to follow later this year, possibly to the autumn. Pricing and final configurations have not been disclosed.
